Zeus Laser Marking System
Zeus laser marking system, also called laser cutting system of flexible printed circuit(FPC) board, is dedicated to camera accurate positioning processing. With features of accurate positioning, online scanner calibration, multi-station and multi-layer processing, precision processing, and graphic editing function, this system will be the ideal high precision control system for all industrial applications, such as laser precision engraving, laser drilling, laser cutting, laser cutting of flexible printed circuit board, and chip processing and inspection.
Secondary offset for positioning point, light path offset, automatic detection of kerf cutting effect, automatic identification and verification of processed barcode, focal length offset for designated areas, motor control by bus mode, multiple scanner protocols, custom area/order offset
Large field for multi-product positioning, inlet and outlet supply, roll cutting, multiple stations, multiple lasers, optimization of processing path
Open MES communication, EMAPING, closed-loop factory management, built-in CAD function for optimal editing of drawing files, compatible with multiple brands of laser communication and control, various scanning solutions, custom procedures for automation needs
Combined with the simultaneous operation of the scanner and the XY station, its processing results are extremely better than that of scanner processing. Compared with the traditional splicing processing, the integrity of cutting lines is guaranteed besides the efficiency of the scanner processing.
Fly Positioning Marking
During the acquisition of MARK points, the camera and the workpiece remain in relative motion, which improves productivity by reducing the time from motion deceleration to standstill compared with the cycle mode of motion-stabilization-image acquisition.
Laser Cutting of Flexible Printed Circuit(FPC) Board
FPC features small in size, thin thickness, lightweight, and short cycle for design and production. In the final cutting procedure of FPC production, the accuracy and stability of the cutting position are extremely important. Otherwise, a large number of FPC will be wasted. Traditional die-cutting requires die-casting according to the product, whose production cycle is long. In contrast, Zeus laser marking system(or laser cutting system of flexible printed circuit board) only needs product drawings and simple editing to complete the setup of dies. With the miniaturization of electronic products, the need for FPC cutting equipment is increasing.
Laser ITO/ Silver Paste Etching
ITO film, a typical transparent conductive material, is widely used in touch display devices, solar energy, outdoor glass, and other fields. Etching circuit structure on its surface is needed in its production. The traditional chemical method is unable to process high-density products in small sizes. By comparison, Zeus laser marking system(or laser cutting system of flexible printed circuit board) is advantageous to laser etching due to its effective control of the spot size and its adjustment according to die sizes through software, therefore increasing yield. In addition, only import of drawings to edit products is needed, which is simple, convenient, and low cost.
XYZA Four-axis + Galvo Processing
Zeus laser marking system(or laser cutting system of flexible printed circuit board) can accomplish multi-sided processing or marking by coordinating XYZA axes, fixtures, and 2D Galvo. Simple and self-set editing is available with the guarantee of accuracy and efficiency. It is also suitable for product processing in small quantities and no special dies are needed for different equipment.
Surface Splicing of the Multi-diameter Long Axis
The inaccurate distortion calibration of the 2D scanning area results in an obvious splicing line in columnar splicing of the circular axis. The processing difficulty increases for circular axes with multiple diameters. Zeus laser marking system(or laser cutting system of flexible printed circuit board) edits drawing files with different diameters separately by layers, which is convenient and simple.
Micro-hole drilling is common in metal processing. High yield can be actualized through laser micro-hole processing due to its non-contact processing without mechanical force. Combining the short-pulse light source, hard and brittle materials, such as ceramics and glass, can be processed. The adjustment of Z-axis parameters to solve 2D scanner’s taper inconsistency to achieve effective control of workpieces’ height and maintain effective focal length processing. The processing area can be expanded by the use of XY axes and the accurate processing area can be positioned by the use of JCZ visual positioning system.
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Headquarter: #22 Building, #13 Mintai Road, Shunyi District, Beijing City, China,101300.
Main Factory: 4th Floor, #15 Building, #13 Mintai Road, Shunyi District, Beijing City, China,101300.
Suzhou JCZ Technology Co., Ltd.
Address: m3-103-2, microsystem Park, Suzhou science and Technology City, No. 2, Peiyuan Road, Huqiu District, Suzhou, Jiangsu
Guangdong JCZ Technology Co., Ltd.
Address: room 1002, No. 4, Songhu Zhigu R & D center, No. 1, renju Road, Liaobu Town, Dongguan City, Guangdong Province
Beijing JCZ Technology Co., Ltd. Wuhan Branch
Address: 1101, block B, building 1, modern service industry base, Huagong science and Technology Park, University Park Road, Jiangxia District, Wuhan, Hubei Province