The system is equipped with the high-resolution encoder and the ultra-fast laser; therefore, ultra-speedy fly hole-drilling can be actualized with precise and controllable hole spacing and numbers, and the processing time is not affected by hole density. It is advantageous to hole-drilling of thin film and silicon wafers.
It substitutes the polygon lens for the traditional lens and is also equipped with the advanced bearing and axis. Its line scanning speed maximizes 300m/s. Speedy laser marking, speedy bitmap scanning, dot matrix barcode, font processing, and other applications can be accomplished with high speed and premium heat dissipation.
It features an offline processing function, which can be applied to offline process fixed processing content. The separate operation of the controller effectively avoids the unstable communication of the computer and the controller, thus improving system stability. That is more suitable for industrial automated production.
Its multi-scanner synchronous processing function solves the field limitation of single equipment and can be applied to the processing of wide field and infinite length of roll materials.
Suzhou JCZ Technology Co., Ltd.
Address: m3-103-2, microsystem Park, Suzhou science and Technology City, No. 2, Peiyuan Road, Huqiu District, Suzhou, Jiangsu
Guangdong JCZ Technology Co., Ltd.
Address: room 1002, No. 4, Songhu Zhigu R & D center, No. 1, renju Road, Liaobu Town, Dongguan City, Guangdong Province
Beijing JCZ Technology Co., Ltd. Wuhan Branch
Address: 1101, block B, building 1, modern service industry base, Huagong science and Technology Park, University Park Road, Jiangxia District, Wuhan, Hubei Province